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Ecner Array

Product Overview

The Ecner Array Packing Element System is designed to withstand high temperature and high-pressure applications. It has OEM’s Anti-Extrusion Backup System that allows it to perform in elevated applications.
 

Features

•    Field Tested     

           o Up to 15kpsi     

           o Up to 450F

•    Permanent and Retrievable Applications

•    NBR, HNBR, Aflas, and FKM Material Options

•    Low Setting Load

•    Anti-Extrusion Backup System

•    H2S and CO2 Resistant Options

•    Industry used for decades Applications

•    Completions

•    Well Intervention

•    Wellbore Cleanup

•    Production

Downloadable pdf

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