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Ecner Array
Product Overview
The Ecner Array Packing Element System is designed to withstand high temperature and high-pressure applications. It has OEM’s Anti-Extrusion Backup System that allows it to perform in elevated applications.
Features
• Field Tested
o Up to 15kpsi
o Up to 450ËšF
• Permanent and Retrievable Applications
• NBR, HNBR, AFLAS, and FKM Material Options
• Low Setting Load
• Anti-Extrusion Backup System
• H2S and CO2 Resistant Options
• Industry used for decades
Applications
• Completions
• Well Intervention
• Wellbore Cleanup
• Production
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